- Unparalleled expertise and throughput
- Printed boards, solder joints, components and related features of electronic assemblies
- Next business afternoon turns for structural integrity (Group A) testing
- Evaluation and imaging with top of the line microscopes/optics and cameras
- Liquid-to-liquid thermal shock, and
- Single chamber air cycling
Convection Reflow Simulation
- Feedback controlled, batch oven, forced air convection reflow simulation.
- This allows us to guarantee conformance with IPC-TM-650 method 2.6.27, J-STD-020, or your custom profile every time with no profiling overhead.
Many other mechanical services are available.