|
Scope page 2
|
Land Bond Strength,
Unsupported Component Hole |
2 |
4 |
21 |
|
Mechanical Dimensional
Verification |
2 |
2 |
1 |
|
Microsectioning Automatic
Technique |
2 |
1 |
1.2 |
|
Microsectioning, Manual Method |
2 |
1 |
1 |
|
Moisture and Insulation
Resistance, Fluxes |
2 |
6 |
3.3 |
|
Moisture and Insulation
Resistance, Polymeric Masks and |
2 |
6 |
3.1 |
|
Moisture and Insulation
Resistance, Printed Boards |
2 |
6 |
3 |
|
Optical Dimensional
Verification |
2 |
2 |
2 |
|
Peel Strength of Metallic Clad
Laminates |
2 |
4 |
8 |
|
Resistance Test, Plated
Through-Holes |
2 |
5 |
32 |
|
Rework Simulation,
Plated-Through Holes for Leaded |
2 |
4 |
36 |
|
Shorts, Internal on Multilayer
Printed Wiring |
2 |
5 |
16 |
|
Solderability of Metallic
Surfaces |
2 |
4 |
14 |
|
Solderability, Edge Dip Method |
2 |
4 |
12 |
|
Surface Examination, Unclad
and Metal Clad Material |
2 |
1 |
5 |
|
Surface Insulation Resistance
of Raw Printed Wiring Board |
2 |
5 |
27 |
|
Surface Scratch Examination
Metal Clad Foil |
2 |
1 |
9 |
|
Temperature Cycling, Printed
Wiring Board |
2 |
6 |
6 |
|
Tensile Strength and
Elongation, Copper Foil |
2 |
4 |
18 |
|
Tensile Strength and
Elongation, In-House Plating |
2 |
4 |
18.1 |
|
Thermal Shock &
Continuity, Printed Board |
2 |
6 |
7 |
|
Thermal Shock, Continuity and
Microsection, Printed Board |
2 |
6 |
7.2 |
|
Thermal Shock, Polymer Solder
Mask Coatings |
2 |
6 |
7.1 |
|
Thermal Stress of Laminates |
2 |
4 |
13.1 |
|
Thermal Stress, Laminate |
2 |
6 |
8.1 |
|
Thermal Stress, Plated
-Through Holes |
2 |
6 |
8 |
|
Visual Examination per
IPC-A-600 |
0 |
0 |
1 |
|
Monday, August 02, 1999 |
Page 2 of
2 |
|
