Robisan Laboratory, Inc.
6502 E. 21st St. Indianapolis, IN  46219  Phone (317)353-6249  Fax (317)917-2379
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 document title paragraph

ANSI/J-STD 003

Test A--Edge Dip Test 4 2 1

Test C--Solder Float Test 4 2 3

IPC-TM-650

Adhesion, Marking Paints and Inks 2 4 1.1

Adhesion, Overglaze(Hybrid Circuits) 2 4 1.4

Adhesion, Polymer Coating 2 4 1.6

Adhesion, Resistors(Hybrid Circuits) 2 4 1.3

Adhesion, Solder Mask (Non-melting metals) 2 4 28

Adhesion, Solder Mask, Flexible Circuits 2 4 29

Adhesion, Solder Mask, Tape Test Method 2 4 28.1

Adhesion, Tape Test 2 4 1

Bow and Twist 2 4 22

Bow and Twist - Laminate 2 4 22.1

Chemical Resistance, Marking Paints and Inks 2 3 4

Detection and Measurement of Ionizable Surface 2 3 25

Contaminants

Determination of Thickness of Laminate by Mechanical 2 2 18

Measurement

Determination of Thickness of Metal Clad Laminate, 2 2 18.1

Cross-sectional

Dielectric Withstanding Voltage, PWB 2 5 7

Dimensional Inspections Using Microsections 2 2 5

Flexural Fatigue and Ductility, Flat Cable 2 4 33

Flexural Fatigue and Ductility, Flexible Metal Clad Dielectrics 2 4 3.2

Flexural Fatigue and Ductility, Flexible Printed Wiring 2 4 3.1

Flexural Fatigue and Ductility, Foil Copper 2 4 2.1

Hole Size Measurement, Drilled 2 2 6

Hole Size Measurement, Plated 2 2 7

Hydrolytic Stability, Flexible Printed Wiring Material 2 6 17

Hydrolytic Stability, Solder Mask and Conformal Coatings 2 6 11

Inspection for Inclusions and Voids in Flexible Printed 2 1 13

Wiring Materials

Insulation and Moisture Resistance, Flexible Base Dielectric 2 6 3.2

Insulation Resistance, Multilayer Printed Wiring (Between 2 5 10

Layers)

Insulation Resistance, Multilayer Printed Wiring (Within a 2 5 11

Layer)

Interconnection Resistance 2 5 12

Monday, August 02, 1999 Page 1 of 2

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